l Turntable design. One upper mold serves two bottom molds.
l Melt-On-Demand tank melts the resin completely in 18 minutes, taking 6208 hot melt adhesive as example, temperature at 200 °C.
l Equipped with dual 1 liter melting tank to fit different color resin or different model resin.
l Hot runner system eliminates runner resin and improve productivity.
l Built-in chiller.
l The only independent dual dispensing low pressure molding system in the industry.
l Injection pressure can be adjusted by the touch screen precisely.
l Temp in different temp zones like tank, hose, hot runner, hot nozzles can be set independently.
l Automatic feeding system and ejection system is equipped.
Our machines are engineered for low pressure molding applications. Using specialty resins to encapsulate delicate parts.
Applications including : automotive electronics, PCBA，coil, fiber-optic, LED lighting, wire, cable, etc.
Machine Size (Width, Depth, Height) / Weight
1135 mm x 1442 mm x 1803 mm / 450 kg
44.69 in x 56.77 in x 70.98 in / 992 lbs
Working Station Height
850 mm | 33.47 in
1135 mm x 2100 mm | 44.69 in x 82.67 in
Packaging Size (Width, Depth, Height) / Weight
1250 mm x 1560 mm x1850 mm / 500 kg
49.21 in x 61.42 in x 72.83 in / 1102 lbs
Melting Tank Model & Q'ty
MOD-01-900MD-DSAF x 2
Auto Feeding System
Gun Model & Tip
Hot Runner System
Each Station Gun Tip Q'ty
Std.4，depends on part design
Heated Hose Model & Q'ty
LPMS-H12J x 2
200-240 VAC / 1 Phase / 50 Hz
Temperature Control Zones
Ambient up to 250°C / 485°F
Min. Air Pressure
0.5 MPa | 73 Psi
0.1m3/min | 3.53ft3 / min
75 mm | 2.95 in
25 mm | 0.98 in
Tooling Temp Control
PLC+7 in HMI
Light Curtain , Safety door
Standard Mold set Size/Weight
250 mm x 150 mm x 308mm / 75 kg
9.84 in x 5.91 in x12.13 in / 165 lbs
Max. Mold set Size
300 mm x 200 mm x 308 mm
11.81 in x7.87 in x12.13 in
Max. Part Size
60 mm x 50 mm x 18 mm
2.36 in x1.97 in x 0.71 in