Technical Support

      Some common problems in electronic waterproof protection technology are listed below for reference. Due to the influence of various factors such as the requirements of product structure and use environment in the actual application process, the problems encountered and corresponding solutions are also different. For any technical support, please contact us.

What the Benefits of Low Pressure Molding?

LPM can over-mold extensively products and enhance product performance.LPM technology benefits mainly reveal in two aspects below: 

Product Performance

  • Environmentally friendly (RoHS).

  • Water-proof. 

  • Electrical insulation.

  • Mechanical protection from impact. 

  • Resistance to temperature (UL94 V-0).

  • Resistance to Chemical. 


  • Simplify the process, enhance productivity.

  • Shorten the development cycle, reduce the R&D cost.

  • Save production space.

  • No hazardous materials during production.

  • Thermoplastic no cure time and increased reliability.

  • Molds design flexibility.

What is the Application of Low Pressure Molding?

     Low pressure molding technology can be applied to wide range of industries and any unique product that needs to be sealed and protected against the environment such as PCB, automotive electronics, automotive wire, connector, sensor, micro switch etc.

     More Application details:

What is different between Low pressure molding and Traditional molding?

      LPMS selects high performance hot-melt adhesive, which has excellent mobility. The adhesive takes very small pressure to make it flow to mold, therefore, the products successfully over-molded without causing any harm in the process, greatly reducing the defect product.

PA Hot melt LPM

Traditional molding


PA Hot melt resin


Injection pressure

1.5~40 bar

350~1,300 bar

Injection temperature



Clamping force

1 Ton

Over 50 Tons

Mould material

Steel and aluminum

Only steel

Damage to the mold

No damage

Wear and tear

Injection machine

Air cylinder driven

Hydraulic driven

What is different between Low Pressure Molding and Epoxy Potting?

PA Hot melt LPM

Epoxy molding



Meed case

Working temperature




No need housing

Need housing

Cycle time

2-60 seconds

Chemical reaction needs 24 hours



Above 1.2


Much less curing time

Need curing

Working space

Occupy less space

Occupy large space

Energy consumption



Resin consumption


Much more




Vacuum pumping

No need


How much is the shrinkage rate of material after low pressure injection molding?

       Low pressure molding material’s shrinkage rate is slightly lower than  traditional molding material. Low pressure molding contraction ranges between 1%~1.5%. It depends on materials.

How to avoid air bubbles in the product?

  • Mold structure design, such as increasing the exhaust inserts, the way of injection.

  • Mold DFM.

  • For larger injection volume products, we might design multiple injection to avoid it.

  • Using transparent resin to test and adjust molding parameters through mold trial and small production of the samples.

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