With the rapid development of electronic industry in china, LPMS Internatonal Ltd. brought the fully developed Hot melt LPM(Hot melt Low Pressure Molding) technology into China and we devoted to promoting Hot melt LPM technolgy, which not only reduce the total production cost but also enhance the competitiveness of product.

     Hot melt Low Pressure Molding with hot-melt materials (polyamide, polyolefin,PUR.ect )is a process typically used to encapsulate and environmentally protect electronic components. The purpose is to protect electronics against moisture, dust dirt and vibration.