Low Pressure Molding with PA hot-melt materials is a process typically used to encapsulate and environmentally protect electronic components. The purpose is to protect electronics against moisture, dust dirt and vibration.
The process was initially invented by Henkel in Europe in the 1970s where experiments with hot-melts were used to seal connectors and create strain reliefs for wires. The first commercial use of the Low Pressure Molding process was in the automotive industry. The driving force was to replace toxic and cumbersome potting processes, shorten cycle time, lighter parts and environmentally protect components.