The 3-day NEPCON Exhibition in Hanoi, Vietnam, has come to a successful conclusion!
LPMS once again participated in this industry event with a complete set of integrated low pressure molding solutions. Continuous on-site negotiations took place at Booth A31, winning full recognition from overseas customers, and marking a successful conclusion to this overseas exhibition.

Smart manufacturing goes global, making an appearance at Vietnam's top electronic industry exhibition
NEPCON Hanoi is a highly influential electronics manufacturing exhibition in Vietnam with significant scale, bringing together manufacturers across the entire industrial chain of electronic packaging, precision machining, and automation equipment. It attracts leaders, purchasing managers, and R&D engineers from electronics factories across Southeast Asia to visit, serving as a core business platform for securing overseas orders and expanding into Southeast Asian markets.
At this exhibition, LPMS, centered on domestically produced low pressure molding equipment, comprehensively demonstrated its one-stop supporting capabilities in equipment, molds, adhesives, and encapsulation processes to overseas customers, delivering mature and implementable domestically made intelligent manufacturing solutions to the electronics manufacturing industry in Southeast Asia.
Booth A31 enjoys high popularity, with its low pressure molding solution receiving widespread acclaim.
Over the three days of the exhibition, Booth A31 was constantly bustling with visitors, with many customers coming specifically to inquire about waterproof packaging solutions for wire harnesses, sensors, and PCB components.
The on-site business team provides one-on-one explanations of equipment advantages, mass production processes, and customized mold services, offering a direct comparison of the differentiated advantages between traditional potting processes and low pressure molding:
1. Low pressure molding with gentle pressure that will not damage internal precision components.
2. Equipped with a multi-cavity mold, it enables one-step molding, significantly improving batch production efficiency.
3. The finished product has multiple protective properties including insulation, waterproofing, dust prevention, and aging resistance.
The entire solution is suitable for the production of multiple categories, including automotive electronics, new energy wire harnesses, precision sensors, and smart home accessories, effectively helping Southeast Asian factories improve product yield and reduce production costs.


Although the exhibition has ended, cooperation and services will never stop.
The three-day exhibition not only served as a showcase of brand strength but also acted as a bridge for in-depth exchanges between industry partners at home and abroad. Through this Hanoi exhibition, we precisely connected with a large number of potential customers in Southeast Asia, further improved our brand's overseas market layout, and solidified LPMS overseas reputation in the low-pressure injection molding encapsulation sector.

Although the exhibition has concluded, our services remain continuously available. In the future, LPMS will continue to delve deeper into the research and development of low pressure molding technology, improve complete sets of equipment and mold solutions with high stability and adaptability, continuously explore the Southeast Asian market, and work hand in hand with global manufacturing enterprises for mutual benefit with high-quality equipment and full-process supporting services.
If you have any requirements for waterproof and insulating packaging prototyping, mass production, or whole-line procurement of wire harnesses, sensors, and PCB boards, please feel free to contact us at any time!
One-stop services from the source manufacturer: equipment sales + mold customization + process debugging + sample prototyping
LPMS International Ltd.
Professional low pressure molding solution provider, supporting customized implementation of production lines both domestically and abroad.
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