Turntable design. One upper mold serves two bottom molds.
Melt-On-Demand tank melts the resin completely in 18 minutes, taking 6208 hot melt adhesive as example, temperature at 200 °C.
Equipped with dual 1 liter melting tank to fit different color resin or different model resin.
Hot runner system eliminates runner resin and improve productivity.
The only independent dual dispensing low pressure molding system in the industry.
Injection pressure can be adjusted by the touch screen precisely.
Temp in different temp zones like tank, hose, hot runner, hot nozzles can be set independently.
Automatic feeding system and ejection system is equipped.
Our machines are engineered for low pressure molding applications. Using specialty resins to encapsulate delicate parts.
Applications including : automotive electronics, PCBA，coil, fiber-optic, LED lighting, wire, cable, etc.
Machine Size (Width, Depth, Height) / Weight
44.69 in x 56.77 in x 70.98 in / 992 lbs
Working Station Height
850 mm | 33.47 in
44.69 in x 82.67 in
Packaging Size (Width, Depth, Height) / Weight
49.21 in x 61.42 in x 72.83 in / 1102 lbs
MOD-01-900MD-DSAF x 2
Auto Feeding System
Hot Runner System
Each Station Gun Tip Q'ty
Std.4，depends on part design
200-240 VAC / 1 Phase / 50 Hz
Temperature Control Zones
Ambient up to 250°C / 485°F
Min. Air Pressure
0.5 MPa | 73 Psi
3.53ft3 / min
25 mm | 0.98 in
Tooling Temp Control
PLC+7 in HMI
Light Curtain , Safety door
Standard Mold set Size/Weight
9.84 in x 5.91 in x12.13 in / 165 lbs
Max. Mold set Size
11.81 in x7.87 in x12.13 in